Laminados Normales

 

LEGACY MATERIALS

Thermoset PCB Materials For MmWave Designs Isola

Legacy materials are mature products that we have produced and sold for more than 10 years. These products have provided our customers the performance requirements they have needed for thousands of designs. Materials in this category are still being manufactured and sold, but are no longer being actively promoted.

High thermal reliability

HIGH THERMAL RELIABILITY

 

 

 

 

Thermal reliability requirements can be separated into two categories. The first involves survival of a PCB through assembly without defects such as blisters or delamination. The second category involves thermal reliability in the operating environment over a product’s lifetime. Both types of thermal reliability are critical.

While excellent thermal reliability through assembly has always been important, the advent of lead-free assembly has required further enhancements to printed circuit materials in recent years due to the higher assembly temperatures required. In addition, many products that have had exemptions for lead-free assembly will need to convert to lead-free assembly in the near future. Often, these are the more complex PCB designs where thermal requirements are already demanding.

Beyond lead-free assembly, applications where PCBs are exposed to harsh operating environments also require thermally robust materials. Isola offers several products with different levels of electrical performance that all possess excellent thermal reliability.

Features:

  • High glass transition temperature, Tg
  • Low CTE
  • High decomposition temperature, Td
  • Low moisture absorption
  • High time to delamination, T-260 & T-288
  • Ease of manufacturing
  • Global availability & technical support

Typical Applications:

  • Lead-free assembly
  • Sequential lamination
  • Automotive
  • Aerospace
  • Military
  • Down-well drilling
  • Telecommunications & Network Infrastructure
  • High-speed computing

 

Product CTE Z-axis Tg
by TMA
Td Dk Df
IS550H 2.2 200 400 4.43 0.016
IS400HR 3.0 150 330 4.20 0.016
P95/P25 1.5 260 416 3.76 0.017
Tachyon® 100G 2.5 200 360 3.02 0.0021
TerraGreen® (RF/MW) N/A 200 390 3.45 0.0032
I-Tera® MT40 (RF/MW) N/A 200 360 3.38 / 3.45 / 3.60 / 3.75 0.0028 – 0.0035
Astra® MT77 N/A 200 360 3.00 0.0017
185HR 2.7 180 340 4.01 0.0200
TerraGreen® 2.9 200 390 3.44 0.0039
I-Tera® MT40 2.8 200 360 3.45 0.0031
I-Speed® 2.7 180 360 3.64 0.0060
FR408HR 2.8 190 360 3.68 0.0092
IS415 2.8 200 370 3.72 0.0120
370HR 2.8 180 340 4.04 0.0210
IS400 3.3 150 330 3.90 0.022
IS420 2.8 170 350 4.04 0.021
P96/P26 1.5 260 396 3.76 0.017

 

 

Alta Densidad

 

HIGH DENSITY INTERCONNECT

Isola HDI Designs

High Density Interconnect (HDI) attributes are printed circuit board designs that employ increased feature density to achieve lighter weight, reduced layer count, and thinner stack ups.

HDI design configurations allow multi-track routing of high I/O, fine pitch devices 0.5 mm and below. Isola is an industry leader in resin system development and has designed several resin systems and construction sets that enable consistent, reliable production of HDI printed circuit board products.  Our high performance products, such as 370HR, provide the thermally robust performance required for sequential lamination cycles of these complex structures. In addition, we incorporate square weaves, spread glass technology that improves laser ablation consistency, critical feature registration, and dielectric thickness control.  We offer our ultrathin glass fabrics down to 1/2 mil (0.02 mm) for many of our high performance products. With these glass styles, Isola provides a glass reinforced 1.0 mil (0.04 mm) laminate that improves composite structure rigidity and array registration when compared to unreinforced solutions.

Features

 

  • Multiple resin systems – High Tg, lead-free, high speed digital, RF, halogen-free
  • Hybrid capability
  • Wide range of RC% prepregs
  • Ultrathin glass styles  – 1027, 1035, 1078, 1067, 1086
  • Square weave and spread glass
  • Ultrathin glass reinforced laminate down to 0.04 mm or 1 mil

Typical Applications

 

  • Servers
  • Personal Electronics
  • Military and Aerospace
  • Layer Count Reduction
  • Sequential Lamination
Poliimida

POLYIMIDE

Iosla Polyimide

Isola offers a  product line of polyimide-based no flow prepreg materials for high temperature printed circuit applications.These products consist of a flame resistant, polyimide‑resin system suitable for military, commercial or industrial electronic applications requiring superior performance and the utmost in thermal properties.

Isola’s materials utilize a polyimide and thermoplastic blend resin, fully cured without the use of Methylenedianiline (MDA), which results in a polymer with a high Tg, without the characteristic difficulties of brittleness and low initial bond strength associated with traditional thermoset polyimides.

Features:

 

  • Greater thermal performance over competitive products with very high epoxy content
  • Maintains bond strength at high temperature
  • Durable resin system
  • Improved processing due to less brittleness
  • Less delamination from machining
  • Meets all OSHA 1910.1050 requirements
  • Halogen-free product offering
  • RoHS Compliant
  • UL – File Number E41625

Applications:

 

  • Military
  • Aerospace
  • Commercial
  • Industrial
Radiofrecuencia y microondas

RF / MICROWAVE

Isola RF Microwave

Isola helps designers achieve smaller, more powerful and durable and less power hungry products.

Today’s RF, microwave and millimeter wave designers are challenged more than ever with the task of achieving an optimal balance between cost and performance when selecting base materials. Key factors include precise control of dielectric thickness, dielectric constant and dissipation factor, achieving lowest tolerance within a batch as well as batch-to-batch. To achieve controlled impedance and consistent electrical performance, along the lines of amplitude and phase response, RF high-frequency designs require extremely precise controls on dielectric constant, line widths and dielectric thickness. If any one of these three factors is changed, variations will be seen in the performance of the circuit. As frequencies increase, designers are looking to controlled dielectric materials as a means of achieving optimal signal performance. This would include the designers also paying closer attention to the selection of copper foils such as VLP-2 (very low profile 2 micron), as well as woven glass styles such as square weave or spread glass styles that would also help improve overall performance and ease of PCB manufacturing.

Alta Frecuencia y Especiales

Representada: ISOLA

Productos:

  • IS680
  • FR408HR
Flexibles

Representada: ISOLA

Productos:

  • IS550H
  • Pyralux™
Laminados Normales

LEGACY MATERIALS

Thermoset PCB Materials For MmWave Designs Isola

Legacy materials are mature products that we have produced and sold for more than 10 years. These products have provided our customers the performance requirements they have needed for thousands of designs. Materials in this category are still being manufactured and sold, but are no longer being actively promoted.

Alta Densidad

 

HIGH DENSITY INTERCONNECT

Isola HDI Designs

High Density Interconnect (HDI) attributes are printed circuit board designs that employ increased feature density to achieve lighter weight, reduced layer count, and thinner stack ups.

HDI design configurations allow multi-track routing of high I/O, fine pitch devices 0.5 mm and below. Isola is an industry leader in resin system development and has designed several resin systems and construction sets that enable consistent, reliable production of HDI printed circuit board products.  Our high performance products, such as 370HR, provide the thermally robust performance required for sequential lamination cycles of these complex structures. In addition, we incorporate square weaves, spread glass technology that improves laser ablation consistency, critical feature registration, and dielectric thickness control.  We offer our ultrathin glass fabrics down to 1/2 mil (0.02 mm) for many of our high performance products. With these glass styles, Isola provides a glass reinforced 1.0 mil (0.04 mm) laminate that improves composite structure rigidity and array registration when compared to unreinforced solutions.

Features

 

  • Multiple resin systems – High Tg, lead-free, high speed digital, RF, halogen-free
  • Hybrid capability
  • Wide range of RC% prepregs
  • Ultrathin glass styles  – 1027, 1035, 1078, 1067, 1086
  • Square weave and spread glass
  • Ultrathin glass reinforced laminate down to 0.04 mm or 1 mil

Typical Applications

 

  • Servers
  • Personal Electronics
  • Military and Aerospace
  • Layer Count Reduction
  • Sequential Lamination
Poliimida

POLYIMIDE

Iosla Polyimide

Isola offers a  product line of polyimide-based no flow prepreg materials for high temperature printed circuit applications.These products consist of a flame resistant, polyimide‑resin system suitable for military, commercial or industrial electronic applications requiring superior performance and the utmost in thermal properties.

Isola’s materials utilize a polyimide and thermoplastic blend resin, fully cured without the use of Methylenedianiline (MDA), which results in a polymer with a high Tg, without the characteristic difficulties of brittleness and low initial bond strength associated with traditional thermoset polyimides.

Features:

 

  • Greater thermal performance over competitive products with very high epoxy content
  • Maintains bond strength at high temperature
  • Durable resin system
  • Improved processing due to less brittleness
  • Less delamination from machining
  • Meets all OSHA 1910.1050 requirements
  • Halogen-free product offering
  • RoHS Compliant
  • UL – File Number E41625

Applications:

 

  • Military
  • Aerospace
  • Commercial
  • Industrial
Radiofrecuencia y microondas

RF / MICROWAVE

Isola RF Microwave

Isola helps designers achieve smaller, more powerful and durable and less power hungry products.

Today’s RF, microwave and millimeter wave designers are challenged more than ever with the task of achieving an optimal balance between cost and performance when selecting base materials. Key factors include precise control of dielectric thickness, dielectric constant and dissipation factor, achieving lowest tolerance within a batch as well as batch-to-batch. To achieve controlled impedance and consistent electrical performance, along the lines of amplitude and phase response, RF high-frequency designs require extremely precise controls on dielectric constant, line widths and dielectric thickness. If any one of these three factors is changed, variations will be seen in the performance of the circuit. As frequencies increase, designers are looking to controlled dielectric materials as a means of achieving optimal signal performance. This would include the designers also paying closer attention to the selection of copper foils such as VLP-2 (very low profile 2 micron), as well as woven glass styles such as square weave or spread glass styles that would also help improve overall performance and ease of PCB manufacturing.

Alta Frecuencia y Especiales

Representada: ISOLA

Productos:

  • IS680
  • FR408HR
Flexibles

Representada: ISOLA

Productos:

  • IS550H
  • Pyralux™