HIGH THERMAL RELIABILITY

Thermal reliability requirements can be separated into two categories. The first involves survival of a PCB through assembly without defects such as blisters or delamination. The second category involves thermal reliability in the operating environment over a product’s lifetime. Both types of thermal reliability are critical.

While excellent thermal reliability through assembly has always been important, the advent of lead-free assembly has required further enhancements to printed circuit materials in recent years due to the higher assembly temperatures required. In addition, many products that have had exemptions for lead-free assembly will need to convert to lead-free assembly in the near future. Often, these are the more complex PCB designs where thermal requirements are already demanding.

Beyond lead-free assembly, applications where PCBs are exposed to harsh operating environments also require thermally robust materials. Isola offers several products with different levels of electrical performance that all possess excellent thermal reliability.

Features:

• High glass transition temperature, Tg
• Low CTE
• High decomposition temperature, Td
• Low moisture absorption
• High time to delamination, T-260 & T-288
• Ease of manufacturing
• Global availability & technical support

Typical Applications:

• Lead-free assembly
• Sequential lamination
• Automotive
• Aerospace
• Military
• Down-well drilling
• Telecommunications & Network Infrastructure
• High-speed computing

• Product SummaryResources

HIGH DENSITY INTERCONNECT

HDI design configurations allow multi-track routing of high I/O, fine pitch devices 0.5 mm and below. Isola is an industry leader in resin system development and has designed several resin systems and construction sets that enable consistent, reliable production of HDI printed circuit board products.  Our high performance products, such as 370HR, provide the thermally robust performance required for sequential lamination cycles of these complex structures. In addition, we incorporate square weaves, spread glass technology that improves laser ablation consistency, critical feature registration, and dielectric thickness control.  We offer our ultrathin glass fabrics down to 1/2 mil (0.02 mm) for many of our high performance products. With these glass styles, Isola provides a glass reinforced 1.0 mil (0.04 mm) laminate that improves composite structure rigidity and array registration when compared to unreinforced solutions.

• Product Summary
• Resources

POLYIMIDE

Isola’s materials utilize a polyimide and thermoplastic blend resin, fully cured without the use of Methylenedianiline (MDA), which results in a polymer with a high Tg, without the characteristic difficulties of brittleness and low initial bond strength associated with traditional thermoset polyimides.

• Product Summary
• Resources

Representada: ISOLA

Productos:

• IS680
• FR408HR

Representada: ISOLA

Product:

• IS550H

Representada DuPont:

• Pyralux™

HIGH DENSITY INTERCONNECT

HDI design configurations allow multi-track routing of high I/O, fine pitch devices 0.5 mm and below. Isola is an industry leader in resin system development and has designed several resin systems and construction sets that enable consistent, reliable production of HDI printed circuit board products.  Our high performance products, such as 370HR, provide the thermally robust performance required for sequential lamination cycles of these complex structures. In addition, we incorporate square weaves, spread glass technology that improves laser ablation consistency, critical feature registration, and dielectric thickness control.  We offer our ultrathin glass fabrics down to 1/2 mil (0.02 mm) for many of our high performance products. With these glass styles, Isola provides a glass reinforced 1.0 mil (0.04 mm) laminate that improves composite structure rigidity and array registration when compared to unreinforced solutions.

• Product Summary
• Resources

POLYIMIDE

Isola’s materials utilize a polyimide and thermoplastic blend resin, fully cured without the use of Methylenedianiline (MDA), which results in a polymer with a high Tg, without the characteristic difficulties of brittleness and low initial bond strength associated with traditional thermoset polyimides.

• Product Summary
• Resources

Representada: ISOLA

Productos:

• IS680
• FR408HR

Representada: ISOLA

Productos:

• IS550H
• Pyralux™

HIGH THERMAL RELIABILITY

Thermal reliability requirements can be separated into two categories. The first involves survival of a PCB through assembly without defects such as blisters or delamination. The second category involves thermal reliability in the operating environment over a product’s lifetime. Both types of thermal reliability are critical.

While excellent thermal reliability through assembly has always been important, the advent of lead-free assembly has required further enhancements to printed circuit materials in recent years due to the higher assembly temperatures required. In addition, many products that have had exemptions for lead-free assembly will need to convert to lead-free assembly in the near future. Often, these are the more complex PCB designs where thermal requirements are already demanding.

Beyond lead-free assembly, applications where PCBs are exposed to harsh operating environments also require thermally robust materials. Isola offers several products with different levels of electrical performance that all possess excellent thermal reliability.

Features:

• High glass transition temperature, Tg
• Low CTE
• High decomposition temperature, Td
• Low moisture absorption
• High time to delamination, T-260 & T-288
• Ease of manufacturing
• Global availability & technical support

Typical Applications:

• Lead-free assembly
• Sequential lamination
• Automotive
• Aerospace
• Military
• Down-well drilling
• Telecommunications & Network Infrastructure
• High-speed computing

• Product SummaryResources

HIGH DENSITY INTERCONNECT

HDI design configurations allow multi-track routing of high I/O, fine pitch devices 0.5 mm and below. Isola is an industry leader in resin system development and has designed several resin systems and construction sets that enable consistent, reliable production of HDI printed circuit board products.  Our high performance products, such as 370HR, provide the thermally robust performance required for sequential lamination cycles of these complex structures. In addition, we incorporate square weaves, spread glass technology that improves laser ablation consistency, critical feature registration, and dielectric thickness control.  We offer our ultrathin glass fabrics down to 1/2 mil (0.02 mm) for many of our high performance products. With these glass styles, Isola provides a glass reinforced 1.0 mil (0.04 mm) laminate that improves composite structure rigidity and array registration when compared to unreinforced solutions.

• Product Summary
• Resources

POLYIMIDE

Isola’s materials utilize a polyimide and thermoplastic blend resin, fully cured without the use of Methylenedianiline (MDA), which results in a polymer with a high Tg, without the characteristic difficulties of brittleness and low initial bond strength associated with traditional thermoset polyimides.

• Product Summary
• Resources

Representada: ISOLA

Productos:

• IS680
• FR408HR

Representada: ISOLA

Productos:

• IS550H
• Pyralux™

HIGH DENSITY INTERCONNECT

HDI design configurations allow multi-track routing of high I/O, fine pitch devices 0.5 mm and below. Isola is an industry leader in resin system development and has designed several resin systems and construction sets that enable consistent, reliable production of HDI printed circuit board products.  Our high performance products, such as 370HR, provide the thermally robust performance required for sequential lamination cycles of these complex structures. In addition, we incorporate square weaves, spread glass technology that improves laser ablation consistency, critical feature registration, and dielectric thickness control.  We offer our ultrathin glass fabrics down to 1/2 mil (0.02 mm) for many of our high performance products. With these glass styles, Isola provides a glass reinforced 1.0 mil (0.04 mm) laminate that improves composite structure rigidity and array registration when compared to unreinforced solutions.

• Product Summary
• Resources

POLYIMIDE

Isola’s materials utilize a polyimide and thermoplastic blend resin, fully cured without the use of Methylenedianiline (MDA), which results in a polymer with a high Tg, without the characteristic difficulties of brittleness and low initial bond strength associated with traditional thermoset polyimides.

• Product Summary
• Resources

Representada: ISOLA

Productos:

• IS680
• FR408HR

Representada: ISOLA

Productos:

• IS550H
• Pyralux™

HIGH THERMAL RELIABILITY

Thermal reliability requirements can be separated into two categories. The first involves survival of a PCB through assembly without defects such as blisters or delamination. The second category involves thermal reliability in the operating environment over a product’s lifetime. Both types of thermal reliability are critical.

While excellent thermal reliability through assembly has always been important, the advent of lead-free assembly has required further enhancements to printed circuit materials in recent years due to the higher assembly temperatures required. In addition, many products that have had exemptions for lead-free assembly will need to convert to lead-free assembly in the near future. Often, these are the more complex PCB designs where thermal requirements are already demanding.

Beyond lead-free assembly, applications where PCBs are exposed to harsh operating environments also require thermally robust materials. Isola offers several products with different levels of electrical performance that all possess excellent thermal reliability.

Features:

• High glass transition temperature, Tg
• Low CTE
• High decomposition temperature, Td
• Low moisture absorption
• High time to delamination, T-260 & T-288
• Ease of manufacturing
• Global availability & technical support

Typical Applications:

• Lead-free assembly
• Sequential lamination
• Automotive
• Aerospace
• Military
• Down-well drilling
• Telecommunications & Network Infrastructure
• High-speed computing

• Product SummaryResources

HIGH DENSITY INTERCONNECT

HDI design configurations allow multi-track routing of high I/O, fine pitch devices 0.5 mm and below. Isola is an industry leader in resin system development and has designed several resin systems and construction sets that enable consistent, reliable production of HDI printed circuit board products.  Our high performance products, such as 370HR, provide the thermally robust performance required for sequential lamination cycles of these complex structures. In addition, we incorporate square weaves, spread glass technology that improves laser ablation consistency, critical feature registration, and dielectric thickness control.  We offer our ultrathin glass fabrics down to 1/2 mil (0.02 mm) for many of our high performance products. With these glass styles, Isola provides a glass reinforced 1.0 mil (0.04 mm) laminate that improves composite structure rigidity and array registration when compared to unreinforced solutions.

• Product Summary
• Resources

POLYIMIDE

Isola’s materials utilize a polyimide and thermoplastic blend resin, fully cured without the use of Methylenedianiline (MDA), which results in a polymer with a high Tg, without the characteristic difficulties of brittleness and low initial bond strength associated with traditional thermoset polyimides.

• Product Summary
• Resources

Representada: ISOLA

Productos:

• IS680
• FR408HR

Representada: ISOLA

Productos:

• IS550H
• Pyralux™

HIGH DENSITY INTERCONNECT

HDI design configurations allow multi-track routing of high I/O, fine pitch devices 0.5 mm and below. Isola is an industry leader in resin system development and has designed several resin systems and construction sets that enable consistent, reliable production of HDI printed circuit board products.  Our high performance products, such as 370HR, provide the thermally robust performance required for sequential lamination cycles of these complex structures. In addition, we incorporate square weaves, spread glass technology that improves laser ablation consistency, critical feature registration, and dielectric thickness control.  We offer our ultrathin glass fabrics down to 1/2 mil (0.02 mm) for many of our high performance products. With these glass styles, Isola provides a glass reinforced 1.0 mil (0.04 mm) laminate that improves composite structure rigidity and array registration when compared to unreinforced solutions.

• Product Summary
• Resources

POLYIMIDE

Isola’s materials utilize a polyimide and thermoplastic blend resin, fully cured without the use of Methylenedianiline (MDA), which results in a polymer with a high Tg, without the characteristic difficulties of brittleness and low initial bond strength associated with traditional thermoset polyimides.

• Product Summary
• Resources

Representada: ISOLA

Productos:

• IS680
• FR408HR

Representada: ISOLA

Productos:

• IS550H
• Pyralux™

HIGH THERMAL RELIABILITY

Thermal reliability requirements can be separated into two categories. The first involves survival of a PCB through assembly without defects such as blisters or delamination. The second category involves thermal reliability in the operating environment over a product’s lifetime. Both types of thermal reliability are critical.

While excellent thermal reliability through assembly has always been important, the advent of lead-free assembly has required further enhancements to printed circuit materials in recent years due to the higher assembly temperatures required. In addition, many products that have had exemptions for lead-free assembly will need to convert to lead-free assembly in the near future. Often, these are the more complex PCB designs where thermal requirements are already demanding.

Beyond lead-free assembly, applications where PCBs are exposed to harsh operating environments also require thermally robust materials. Isola offers several products with different levels of electrical performance that all possess excellent thermal reliability.

Features:

• High glass transition temperature, Tg
• Low CTE
• High decomposition temperature, Td
• Low moisture absorption
• High time to delamination, T-260 & T-288
• Ease of manufacturing
• Global availability & technical support

Typical Applications:

• Lead-free assembly
• Sequential lamination
• Automotive
• Aerospace
• Military
• Down-well drilling
• Telecommunications & Network Infrastructure
• High-speed computing

• Product SummaryResources

HIGH DENSITY INTERCONNECT

HDI design configurations allow multi-track routing of high I/O, fine pitch devices 0.5 mm and below. Isola is an industry leader in resin system development and has designed several resin systems and construction sets that enable consistent, reliable production of HDI printed circuit board products.  Our high performance products, such as 370HR, provide the thermally robust performance required for sequential lamination cycles of these complex structures. In addition, we incorporate square weaves, spread glass technology that improves laser ablation consistency, critical feature registration, and dielectric thickness control.  We offer our ultrathin glass fabrics down to 1/2 mil (0.02 mm) for many of our high performance products. With these glass styles, Isola provides a glass reinforced 1.0 mil (0.04 mm) laminate that improves composite structure rigidity and array registration when compared to unreinforced solutions.

• Product Summary
• Resources

POLYIMIDE

Isola’s materials utilize a polyimide and thermoplastic blend resin, fully cured without the use of Methylenedianiline (MDA), which results in a polymer with a high Tg, without the characteristic difficulties of brittleness and low initial bond strength associated with traditional thermoset polyimides.

• Product Summary
• Resources

Representada: ISOLA

Productos:

• IS680
• FR408HR

Representada: ISOLA

Productos:

• IS550H
• Pyralux™

HIGH DENSITY INTERCONNECT

HDI design configurations allow multi-track routing of high I/O, fine pitch devices 0.5 mm and below. Isola is an industry leader in resin system development and has designed several resin systems and construction sets that enable consistent, reliable production of HDI printed circuit board products.  Our high performance products, such as 370HR, provide the thermally robust performance required for sequential lamination cycles of these complex structures. In addition, we incorporate square weaves, spread glass technology that improves laser ablation consistency, critical feature registration, and dielectric thickness control.  We offer our ultrathin glass fabrics down to 1/2 mil (0.02 mm) for many of our high performance products. With these glass styles, Isola provides a glass reinforced 1.0 mil (0.04 mm) laminate that improves composite structure rigidity and array registration when compared to unreinforced solutions.

• Product Summary
• Resources

POLYIMIDE

Isola’s materials utilize a polyimide and thermoplastic blend resin, fully cured without the use of Methylenedianiline (MDA), which results in a polymer with a high Tg, without the characteristic difficulties of brittleness and low initial bond strength associated with traditional thermoset polyimides.

• Product Summary
• Resources

Representada: ISOLA

Productos:

• IS680
• FR408HR

Representada: ISOLA

Productos:

• IS550H
• Pyralux™